Showing posts with label Mobile Internet Devices. Show all posts
Showing posts with label Mobile Internet Devices. Show all posts

Intel Moves to Larrabee into 2010 || What a move

Jun 28, 2009

According to a report published by c’t magazine, Intel is now aiming to launch Larrabee in a variety of flavors in 2010 and has scrapped the previous late 2009 plan. Intel’s Joseph Schultz made this comment during the opening of a visual computing research center in Saarbruecken, Germany. Spokesman Nick Knupffer confirmed the narrowed-down date, but declined to provide further comments.
Schultz also told c’t that it will be a “big challenge” to compete with Nvidia’s and AMD’s products and especially highlighted the power-efficiency achieved by AMD’s Radeon graphics cards.

Intel is very careful providing any information about its x86-based Larrabee. What we know, however, is that the device will be based on second-generation Pentium processor technology with the P54C core. The first Pentium core (P5, 800 nm, 60 and 66 MHz) was in development since 1989 and was introduced in 1993. The P54C was launched in 1994 with speeds up to 120 MHz, while the succeeding 350 nm P54CS reached 200 MHz. The 55C core (280 nm up to 233 MHz) followed in 1995 and was replaced with the Pentium II in 1997.

Larrabee is expected to come in multiple flavors with at least 8 cores at the low-end have at least 32 cores on the high-end. At a clock speed of 2 GHz, the 32-core version could be topping a theoretical maximum performance of 2 TFlops.

Intel Declares War || Can You Imagine This

Intel and Taiwan Semiconductor Manufacturing Company (TSMC), one of the world’s largest chip foundries, just announced a marketing collaboration involving Intel’s Atom processor. Atom is Intel’s effort to downsize its processor chips to fit into the realm of emerging smart devices below the Personal Computer space. TSMC will work closely with Intel to port some of the Atom processors to its own process and design flows. TSMC will also have the ability to do engineering on the chip to build customized versions for the large number of existing TSMC customers. However, Intel will have ownership of the final device and the customer, as Intel will be selling the custom designed chips that TSMC designs and builds in its foundry.

As PC sales wane, and their chip revenues along with them, Intel looks to additional sources for revenues. Consumer products represent a massive potential market, though at clearly lower margins and price points. But, Intel’s cost of operations makes it a supplier at too high a price to go after the cut-throat and highly price sensitive consumer market. And Intel is not set up for customized, System On Chip (SOC) solutions the market demands. Enter a partner that can bring all of this capability to Intel – TSMC.

This is a direct attack by Intel on competing processors, especially the ARM processor, which is trying to move upstream from the smart phone and embedded gadgets market it currently dominates, while Intel is trying to move downstream with Atom into this overlapping space. The battleground in the middle will be aggressive and likely bloody, with huge potential returns. And while Intel’s attack is primarily on ARM, it also has profound effect on other players – AMD, Qualcomm (Snapdragon), Nvidia, TI, and even Marvel to whom Intel sold off its own ARM-based processor (XScale).

Nokia and Intel Collaborate On Mobile Devices

Jun 27, 2009

Intel announced a technology partnership with Nokia that could potentially give the chip maker the breakthrough it has been looking for into the mobile market.

The companies said last night they would work together on a new class of mobile computing devices, but would not say when they would come to market or give details on the kind of wireless products they hoped to develop together.

Analysts saw the pact as strategically important for Intel in the long term because it gains the world's top cellphone maker as a potential client.

But given the lack of details, analysts said it could take one or two years for products to come to market, and it remained to be seen if they would find favour with consumers.

"Intel at least has its foot in the door. It's an important and strategic customer," said Gartner analyst Jon Erensen, who sees the partnership as a way for Intel to get into the market for advanced phones known as smartphones.

However, he added, "You're probably talking about something like 2011 before you get down to the power consumption and integration (levels) you'd need for that kind of device."

Analysts said the deal gives Intel a chance to take on leading cellphone chip makers Qualcomm Inc and Texas Instruments, a big Nokia supplier.

It could also mean stiffer competition for ARM Holdings , which supplies core cellphone processors to both Texas Instruments and Qualcomm, and whose customers rely in part on software from Wind River Systems.

Intel said earlier this month that it would buy Wind River, whose software speeds up and connects devices made by Samsung Electronics, Apple, Hewlett-Packard Co and Motorola.

Intel, whose microprocessors are found in eight out of 10 personal computers, already works with LG Electronics on mobile devices. The agreement with Finland's Nokia, the world's largest cellphone maker, is a bigger step.

Intel Chief Executive Paul Otellini has said that the handheld, embedded and netbook markets would be as important for the company as the PC market in the near future.

Under the agreement, Intel will buy intellectual property from Nokia related to high-speed wireless technology. They also plan to collaborate on open-source mobile Linux software projects, which some analysts say will compete with Google's Android software in the netbook and mobile Internet device (MID) market.

Intel and Nokia said they aimed to define "a new mobile platform beyond today's smartphones, notebooks and netbooks" for hardware, software and mobile Internet services. They stressed the pact was about their technology collaboration and not about specific products.

Nokia Pact Won't Fix Intel's Atom Chip

Jun 26, 2009

INTEL (TICKER: INTC) and Nokia (NOK) announced a strategic alliance to develop Intel architecture-based mobile chips and open-source software. The goal appears to be creating open and standards-based technologies to explore new ideas and products in mobile computing and communications.

Collaborative efforts between the two companies will be centered around these three initiatives: definition of mobile chipset based on Intel architecture; development of open-source software infrastructure such as Nokia's Maemo and Intel's Moblin; and Intel licensing of Nokia's HSPA/3G modem internet protocol ...

Dell Grows Intel 'Nehalem EP' Iron

INTEL LEADS the CPU market, full stop. More than ever, perhaps. So, why change its perfectly good branding then? After all, Core 2 - and Core 3, and so on - does sound better than Pentium, Hexium or Sexium, and definitely far better than Itanium, all names sounding like some evil Big Pharma drugs.

Aside from a lot of extra marketing and sales work, resulting in marketeers keeping their jobs in these tight times, there doesn't seem to be any real reason to rehash the branding just because of the Nehalem arrival.

The new chips, rather than being called say Core 3, got the brand new Core i7 moniker, in a way reminding us of the old P7 codename. Now, the dual-channel mainstream Nehalems will be called Core i5, and the low-end integrated-graphics parts might bear the burden of the Core i3 brand. And, just like the current i7 with the brand new three-digit product numbers instead of the old four-digit ones, you'll have an interesting time comparing chip models.

So, when you do your holiday system shopping later this year, you could, for instance, choose between the old Core i7 965, the new Core i7 960 or the brand new Core i5 XXX (I didn't say '860'). While all three are internally basically the same CPUs and run at a 3.2GHz clock, the differences will be there. The first one is the old 2008-launch part with unlocked multiplier but C0 stepping. The second one is to be the new part late this year, with locked multiplier but newer, more efficent D or even E stepping. And, finally, the last part will have two memory channels and the LGA1156 versus LGA1366 socket, but faster Turbo mode and of course cheaper P55-based mainboards. Love the confusion?

Many publications commented on the new branding approach, with mixed reactions. There is no clear connection to the old Core 2 branding, and even the product numbering was completely rehashed. Core 2 Quad Extreme QX9770 and Core i7 Extreme 965 cover the same market segment and run at the same default clock and, in fact, aren't that far apart in performance. But there's no correlation at all in the naming. The old Pentium, Pentium 2, Pentium 3 approach was, in this respect, more consistent.

Why not look at something like that, since Intel already went with this BMW-style numbering? The "7" series is the high end, the "5" series is the mainstream, and the "3" series is doing the basic work. An obligatory "X" could be added at the end of any Extreme part in the "7" and "5" series, to avoid having to use different basic numbers for otherwise same-clocked extreme and normal, that is, locked parts. A similar "L" could be added for the low power parts, and an "M" for the mobile parts. Plus, of course, a "G" for the graphics-enriched ones.

After all, at the Xeon front, that's the case already. The "W" parts are top bin workstation CPUs, the "X" parts are for high end servers, the "E" parts are the mainstream offerings, and the "L" parts are the low power workhorses for dense and green computing.

Then, there should be enough numbering in reserve to accommodate the 32nm 'Westmere' parts without changing the i7-i5-i3 sequence. Right now this scheme seems to be a bit tight for the i7 series as we'd only have the 980, 985, 990 and 995 numbers available before hitting the four digits, and that has to take care of the next 20 months at least. Aside from that, the possible i8-i6-i4 sequence could then be left for the Sandy Bridge and Haswell generations.

Talking about numbers, in Chinese, eight is a very lucky number, but four isn't. The last murdered Alpha CPU was codenamed EV8, but was supposed to be really called, umm, the 21464. So, maybe, let's skip any future 'i4' at the low end, eh?

Intel Chairman Barrett to Step Down

Intel Chairman Craig Barrett will step down from his post in May, ending a 35-year stint at the world's No. 1 chipmaker, the company announced Friday.

Barrett, who joined Intel in 1974, also served as the chief executive of the company from 1998 through 2005.

"Intel became the world's largest and most successful semiconductor company in 1992 and has maintained that position ever since," said Barrett. "I'm extremely proud to have helped achieve that accomplishment."

Barrett said he was confident that Intel has the right management in place to continue its leadership in the chip making industry.

Jane Shaw, a board member since 1993, will replace Barrett as non-executive chairman in May.

Earlier this week, Intel CEO Paul Otellini announced that last quarter's profit tumbled 90% to $234 million, and reportedly told employees that he couldn't rule out the possibility that Intel might actually lose money in the current quarter. It would be the first time that's happened in more than 20 years.

The company also announced Wednesday that it will be cutting production at two U.S. silicon wafer facilities and closing three facilities in Asia, affecting between 5,000 and 6,000 workers.

Shares of Intel (INTC, Fortune 500) rose 3% in mid-afternoon trading, but the company's stock has lost more than 40% since August.

Switching To Good Reduced Complexity : Intel

Jun 25, 2009

What’s in a name? If you’re Intel, there’s plenty of brand equity in names like Atom, Centrino, Core and Pentium. But there’s also a fair share of confusion, too, among consumers and IT buyers.

And so, Intel is planning on revamping its portfolio of brand names, an effort that revolves around a good-better-best format. In a statement, the company said:

…we are focusing our strategy around a primary ‘hero’ client brand which is Intel Core. Today the Intel Core brand has a mind boggling array of derivatives (such as Core 2 Duo and Core 2 Quad, etc). Over time those will go away in its place will be a simplified family of Core processors spanning multiple levels: Intel Core i3 processor, Intel Core i5 processor, and Intel Core i7 processors. Core i3 and Core i5 are new modifiers and join the previously announced Intel Core i7 to round out the family structure. It is important to note that these are not brands but modifiers to the Intel Core brand that signal different features and benefits. For example, upcoming processors such as Lynnfield (desktop) will carry the Intel Core brand, but will be available as either Intel Core i5 or Intel Core i7 depending upon the feature set and capability. Clarksfield (mobile) will have the Intel Core i7 name.

So glad Intel has taken the complexity out of it. Actually, the company acknowledges that there will be multiple brands in the market next year, including the old names, as the company makes the transition.

Under the Core brand, the i3 represents the entry-level of the Core family, with Core i5 and Core i7 representing the mid-level and high-level products. Celeron will stick around for entry-level computing, Pentium for basic computing and Atom for devices such as netbooks and smartphones. For PCs, think of Celeron being good, Pentium being better and Core being best.

Even Centrino, which came to be synonymous with wireless computing, won’t completely go away. The company plans to transition the name to WiFi and WiMax products next year.

Dell Grows Intel 'Nehalem EP' Iron

Intel Corp., the world's largest chipmaker, will sell processors to Nokia Oyj for mobile devices, marking the biggest breakthrough in Intel's expansion into the phone market.

The two will develop a new mobile device and chips, Intel and Nokia said today in a statement. Intel will also get mobile- phone radio technology from Nokia and the companies will develop versions of the Linux operating system for mobile devices.

Intel, whose microprocessors run more than 80 percent of the world's personal computers, has struggled for about a decade to get a foothold in the market for mobile-phone chips. The company has a unit that sells a scaled-down version of its personal-computer processor. The chip, called Atom, is designed for mobile devices that access the Web and handle basic computing functions.

"Even if they get just a piece of Nokia's business, it's a big deal," said Will Strauss, a Cave Creek, Arizona-based analyst for research firm Forward Concepts. "Nokia is still the biggest cell-phone maker in the world."

In 2006, Intel Chief Executive Officer Paul Otellini scrapped his predecessor's $5 billion investment in chips for mobile devices, after the company was late to the market and failed to win enough customers.

Restarted Effort

Now Otellini is again pushing to get Intel's chips into phones, a bid to lessen the company's reliance on computers, which account for more than 90 percent of sales. A total of 1.21 billion mobile phones were sold globally last year, according to ABI Research in Oyster Bay, New York.

Intel rose 3 cents to $15.71 at 11:18 a.m. New York time in Nasdaq Stock Market trading. The stock had gained 7 percent this year before today. Nokia, based in Espoo, Finland, fell 10 cents to 10.19 euros in Helsinki trading.

Intel Chief Financial Officer Stacy Smith said in February that the company needed to land one of the top five mobile-phone makers if it wanted to build a significant business.

Intel is challenging Texas Instruments Inc., the largest maker of chips used to run programs in mobile phones. San Diego- based Qualcomm Inc., meanwhile, supplies the majority of communications chips for phones. Both companies have said that Intel would struggle to break their dominance because its products use too much power.

Intel announced in February it had landed LG Electronics Inc., the world's third-largest phone maker, as a customer. LG will use an Intel processor to make a mobile Internet device, a cross between a mobile phone and a computer.

Intel's attempts to create a mobile business have foundered in the past, even when they've had announcements of interest from customers, said Jim McGregor, an analyst at Scottsdale, Arizona-based research firm In-Stat.

"They've been dreaming of getting a significant win at Nokia," he said. "It's a big announcement, they're a key guy. The only question now is whether they will actually come out with a product."

The Intel PRO/Wireless WI-Fi

May 31, 2009

The Intel PRO/Wireless network connection is a Wi-Fi CERTIFIED*^ product. Intel® PRO/Wireless 2915ABG Network Connection and Intel® PRO/Wireless 2200BG Network Connection are FIPS validated with the 3eTI supplicant enabled solution.

Wi-Fi certified product Wi-Fi certified product
FIPS 140-2 Inside

TM A Certification Mark of NIST, which does not imply product endorsement by NIST, the U.S. or Canadian Governments.

+
Wireless connectivity and some features may require you to purchase additional software, services or external hardware. Availability of public wireless LAN access points is limited, wireless functionality may vary by country and some hotspots may not support Linux-based Intel Centrino processor technology systems. System performance measured by MobileMark*. System performance, battery life, wireless performance and functionality will vary depending on your specific operating system, hardware and software configurations.

^ Wireless functionality may vary by country and Wi-Fi certification is not supported on Linux*-based Intel® Centrino® processor technology laptops. Check with your PC manufacturer for details. Other names and brands may be claimed as the property of their respective owners.

Intel® PROSet/Wireless Software v10.5 supports PCS and Intel Centrino processor technology based notebooks with Intel® PRO/Wireless 3945ABG Network Connection, Intel® PRO/Wireless 2200BG Network Connection and Intel® PRO/Wireless 2915ABG Network Connection. The software may not be supported by your PC's operating system and/or by your PC manufacturer. Some features may require specific hardware configurations. Check with your PC manufacturer for details.

§ Some security solutions may not be supported by your PC's operating system and may require additional software and/or certain hardware as well as wireless LAN infrastructure support. Check with your PC manufacturer for details.

Intel PRO/Wireless Network Connection

May 28, 2009

Intel® PRO/Wireless Network Connection The Intel® PRO/Wireless Network Connection is the integrated Wireless LAN (WLAN) solution for Intel® Centrino® processor technology and desktop personal computers. The Intel PRO/Wireless Network Connection provides freedom and flexibility to work and play without hunting for a phone jack, network cable, or plugging in a special card. Get connected through wireless LAN networks in your home, in the office, and in wireless LAN hotspots in airports, hotels and coffee shops. +
Deploying WLAN technology in your home and business increases productivity, efficiency and flexibility by enabling faster decision making, reducing down-time, and enhancing employee satisfaction. For more information visit our WLAN ROI and WLAN Deployment web pages.

Intel 855PM Chipset

May 27, 2009

The Intel® 855 chipset family is part of Intel® Centrino® processor technology and is designed to deliver breakthrough performance at lower power. The Intel® 855PM chipset memory controller hub (MCH-M) is a mobile chipset solution that has been optimized to support the Intel® Pentium® M processor, high speed DDR memory and a hub interface to ICH4-M. This chipset has an AGP 4X interface and provides flexible support for high performance discrete graphics solutions.


Features and benefits

400 MHz low power processor system bus Supports 400 MHz system bus for single processor configurations.
Support for up to 2 GB of DDR 333/266/200 memory technology Higher performance & flexibility.
Integrated high-speed USB 2.0 Support for USB 2.0 peripherals for 40X faster data transfer rate and backward compatible to support USB 1.0 devices.
AGP4X interface High-bandwidth interface to provide flexible support for high performance mobile discrete graphics solutions.
Intel® Stable Image technology Enables chipset HW changes, minimizing impact to IT SW image stability.
Dynamic input/output buffer disabling for processor system bus & memory Reduces chipset power consumption by Intelligent activation or power-down of the processor system bus or memory.

Mobile Intel 915PM Express Chipset

May 26, 2009

The Mobile Intel® 915PM Express chipset is a component of the Intel® Centrino® processor technology. It offers support for Intel® High Definition Audio which is a new enhanced audio specification for high quality audio enabling a premium home theater experience.

Mobile Intel® 915PM Express Chipset

The Mobile Intel® 915PM Express chipset also supports up to 2 GB of DDR2 system memory which enables up to 60% increase in peak memory bandwidth and power benefits over DDR memory. Additionally Mobile Intel® 915PM Express chipset supports PCI Express* bus architecture, a highly scalable general purpose I/O for the latest industry peripherals like ExpressCard*.

Features And Benefits

533 MHz Front Side Bus Up to 33% increase in Front Side Bus bandwidth over the previous generation.
Support for dual channel DDR2 400/533 MHz memory technology Up to 60% improvement in peak memory bandwidth and average power savings over DDR memory.
Discrete Graphics Supports a high speed PCI Express* graphics interface for the most demanding gaming and workstation applications.
Intel® Stable Image Technology Supports a unified graphics driver. Enables hardware changes without impact to IT software image stability.
Serial ATA Provides up to 150 MB/sec transfer rate for disk traffic.
Direct Media Interface (DMI) With up to 2 GB/sec concurrent bandwidth, DMI provides up to 4x faster I/O bandwidth compared to previous Intel proprietary Hub link I/O interface.
Integrated high speed USB 2.0 Support for eight USB 2.0 peripherals for maximum 40x faster data transfer and backward compatible to support USB 1.1 devices.
Intel® High Definition Audio (Intel® HD Audio) New audio specification enables increased bandwidth for high quality audio and support for Dolby* Technologies. Also enables power savings during audio activity.
PCI Express* Bus Architecture Enables the next generation of discrete graphics and I/O. Delivers up to a 4 times increase in discrete graphics bandwidth and 2 times the I/O bandwidth. Also supports the latest industry peripherals like ExpressCard*. Low pin count offers maximum bandwidth per pin.

Mobile Intel 945PM Express Chipset

May 24, 2009

TheMobile Intel® 945PM Express chipset supports Intel® Centrino® processor technology and Intel's newest generation Intel® Centrino® processor technology.

Mobile Intel® 945PM Express Chipset


The Mobile Intel® 945PM Express chipset delivers outstanding system performance through high-bandwidth interfaces such as dual-channel DDR2 memory, 667 MHz system bus, PCI Express* x16 graphics port and PCI Express x1 I/O ports, next generation Serial ATA and Hi-Speed USB 2.0 connectivity. Use of the Mobile Intel® 945PM Express chipset includes support for Intel® Active Management Technology, the next generation of remote client network management for business.

Features and benefits

667MHz Front Side Bus Supports Intel® Core™ Duo and Intel® Core™ Solo processors with up to 25% faster data transfer rate compared to the previous generation bus speed.
PCI Express* x16 Interface Delivers greater than 3.5 times the bandwidth over the traditional AGP interface and supports the latest high-performance graphics cards.
PCI Express x1 Interface Offers up to 3.5 times the bandwidth over traditional PCI architecture, delivering faster access to peripheral devices and networking.
Intel® High Definition Audio (Intel® HD Audio)1 Integrated audio support enables premium sound and delivers advanced features such as multiple audio streams and jack re-tasking. The Dolby* PC Entertainment Experience1 is available exclusively on systems with Intel High Definition Audio.
Intel® Matrix Storage Technology2 Enables enhanced performance, power management and data protection for the storage subsystem.
Dual-channel DDR2 667MHz Memory Support Up to 10.7GB/s of bandwith and up to 4GB memory addressability, for faster system responsiveness.
Integrated high speed USB 2.0 Support for 8 USB 2.0 peripherals for maximum 40x faster data transfer and backward compatible to support USB 1.1 devices.

Mobile Intel PM965 Express Chipset

May 23, 2009

The Mobile Intel® PM965 Express Chipset provides Microsoft Windows Vista Premium* support with the highest level of Windows Aero* experience1;. It delivers outstanding system performance through high-bandwidth interfaces such as dual-channel DDR2 memory, 800/533 MHz system bus, PCI Express* x16 graphics port and PCI Express x1 I/O ports, Serial ATA, and Hi-Speed USB 2.0 connectivity. Use of the Mobile Intel PM965 Express Chipset includes support for Intel® Active Management Technology (Intel® AMT) 2.5, the next generation of remote client network management for business.

Features And Benefits

Vista Premium support Enables Vista Premium logo with the highest level of Aero experience.
800 MHz Front Side Bus support Provides up to 20 percent faster data transfer rate compared to the previous generation bus speed.
Support for dual channel DDR2-667 MHz memory technology Support for increased performance memory technology.
Integrated high speed USB 2.0 Support for 10 USB 2.0 peripherals for maximum 40x faster data transfer and backward compatible to support USB 1.1 devices.
Intel® Matrix Storage Manager 7.0 Enables enhanced performance, power management and data protection for the storage subsystem.
Intel® Active Management Technology (Intel® AMT) 2.5 Support for new levels of manageability and support for PC clients in the business environment.

Mobile Intel PM45 Express Chipset

May 22, 2009

Mobile Intel® PM45 Express Chipset


The Mobile Intel® PM45 Express Chipset delivers Microsoft Windows Vista* Premium support with the highest level of Microsoft Windows Aero* experience.1 It delivers outstanding system performance through high-bandwidth interfaces such as dual-channel DDR3 and DDR2 memory support, 1066 MHz system bus, PCI Express* x16 graphics port and PCI Express x1 I/O ports, Serial ATA, and Hi-Speed USB 2.0 connectivity. Use of the Mobile Intel PM45 Express Chipset includes support for Intel® Active Management Technology (Intel® AMT) 4.0, the next generation of remote client network management for business. Use of the Mobile Intel PM45 Express Chipset also includes support for dual graphics with ATI CrossfireX*, for extreme gaming.

Features And Benefits

Microsoft Windows Vista* Premium support Enables Microsoft Windows Vista Premium logo and the highest level of Microsoft Windows Aero* experience with enabled DX 10 support.
1066 MHz Front Side Bus support Provides faster data transfer rate compared to previous generation bus speed.
Support for DDR3 and DDR2 memory technology Support for increased performance and more energy efficient memory technology.
Integrated high speed USB 2.0 Support for 12 USB 2.0 peripherals for maximum 40x faster data transfer and backward compatible to support USB 1.1 devices.
Intel® Matrix Storage Technology 7.0 Enables enhanced performance, power management and data protection for the storage subsystem.
Intel® Active Management Technology 4.0 Support for new levels of manageability and support for PC clients in the business environment.
ATI CrossFireX* support Enables support for dual graphics required for extreme gaming.

Intel Core2 Solo Mobile Processor

May 21, 2009

The Intel® Core™2 Solo processor is the next-generation single-core mobile processor that provides freedom and flexibility to live, work, and play on-the-go. Intel® Core™2 Solo processor


Features And Benefits

Power efficiency

The Intel Core 2 Solo processor has new power-saving features designed to extend the life of your battery. +

Enhanced performance

The Intel Core 2 Solo processor is the next generation single-core processor for power-optimized mobile processing. It is enhanced to handle today's demanding software applications-such as CAD tools, 3D and 2D modeling or serious number-crunching programs.

Smarter, more efficient designs

Intel® Smart Cache enables smarter, more efficient cache and bus design for enhanced performance, responsiveness and power savings.

Intel® Centrino® processor technology

The Intel Core 2 Solo processor is one of many outstanding processor options for the Intel Centrino processor technology platform.

Intel Core2 Duo Mobile Processor

May 20, 2009

Notebook freedom starts here. Unplug and multitask in more places.

Intel® Core™2 Duo mobile processor

When you power your laptop with an Intel® Core™2 Duo mobile processor, you'll get the performance you need for today's mobile multitasking. Built on the breakthrough 45nm hafnium-based technology, the Intel® Core™2 Duo mobile processor gives you plenty of power to run many demanding applications simultaneously, whether at home, in the office, or on on-the-go.

Intel Core2 Extreme Dual-Core Mobile Processor - X9100)

May 17, 2009

Designed for gamers and power-users, the Intel Core 2 Extreme dual-core mobile processor the is world's highest performing dual-core processor&sup2. For those who want an intense, high-performance mobile computing experience, the Intel Core 2 Extreme dual-core mobile processor delivers revolutionary mobile dual-core performance with 3.06GHz frequency, 6MB of shared L2 Advanced Smart Cache, and Intel® Smart Memory Access with a blazing 1066MHz Front Side Bus (FSB).

Experience excellent mobile gaming and multimedia with the raw power, responsiveness and realism of revolutionary mobile dual-core performance. The Intel Core 2 Extreme dual-core mobile processor brings a whole new intensity to mobile gaming.

And just like its quad-core big brother, the Intel Core 2 Extreme dual-core mobile processor also offers the ultimate control to with bus ratio locks (overspeed protection) removed, so you can fine tune your notebook experience for maximum gaming performance.°

Intel Core2 Extreme Quad-Core Mobile Processor - QX9300)

May 16, 2009

Intel® Core™2 Extreme quad-core mobile processor (QX9300)

Achieving clock speeds of up to 2.53GHz, along with an astounding 12 MB of shared L2 cache and a 1066 MHz Front Side Bus (FSB), the Intel Core 2 Extreme quad-core mobile processor is your ultimate engine for hi-def multimedia while powering the latest generation of hardcore games.

The Intel Core 2 Extreme quad-core mobile processor has four cores processing multiple threads and multiple tasks at blistering speeds for an incredible "like you're there" experience in advanced artificial intelligence (AI), particle systems, dynamic physics, and texture generation. As your ultimate engine for creating rich, HD videos with up to 50 percent faster performance when encoding³ and editingΩ video, these processors enable you to perform like a multiple armed monster.

Intel Core2 Extreme Mobile Processor

May 15, 2009

Intel® Core™2 Extreme Mobile Processor

Intel® Core™2 ExtremeDesigned from the ground up for extreme competitive gaming and HD multimedia on the fly, the Intel® Core™2 Extreme processors are the world's highest performing quad-core¹ and dual-core² mobile processors. Delivering all the performance of a desktop, enabled in a revolutionary, sleek, and killer notebook.

As your ultimate engine for hi-def digital content creation, HD multimedia, and a rockin' hardcore gaming experience, these notebooks provide the raw power, responsiveness, and realism you need for the most compute-intensive and multi-threaded apps-wherever you want to be.